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On occasions where components which dissipate high power within the board are needed, IMS (Insulated Material Substrates) boards, which assist with cooling and the distribution of generated heat, are used.
This advanced technology for efficient heat transfer and distribution enables the use of fewer components and cabling that do conventional techniques, thus considerably reducing costs.
The structure is very similar to that of an FR4 laminate substituting the FR4 for a thick aluminum lamina and a high temperature conductive isolation material sheet, usually ceramic or Prepreg (depending on the thicknesses, the conductivity will vary). The tracks will remain on the copper side.
You can find more information about this in the Technical Capabilities and Materials window
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