WE PROVIDE SOLUTIONS

Technical Capabilities for Single Sided Boards

CapabilitiesMinimum CapabilityMaximum CapabilityToleranceRemarks

Metal finishing:
   Hal Lead Free (SnCuNi)
   Chemical Tin (Inm.Sn) (*)
   Chemical Silver (Inm.Ag)
   Electroless Ni Inmersion Gold (ENIG)

 

 



Ni: 3 µm
Au: 0,04 µm

 

 



Ni: 7µm
Au: 0,07 µm 


-


Sn100C Alloyage
(*) Subcontracted

 

Not available for IMS pcbs

Final finishing:
   Liquid PhotoImageable Solder Mask
   Ink Legend
   Conductive Carbon Ink
   Peelable mask


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-

-

A wide range of colours
A wide range of colours

Raw Material:
   FR-4 Tg Standard
   CEM-1
   IMS (Aluminium)


130 ºC

140 ºC

 -
 
Depending on the manufacturer

Base Copper:
   FR-4 Tg Standard
   CEM-1
   IMS (Aluminium)

 


17 µm
35 µm
35 µm


70 µm
35 µm
70 µm

 

Under request (consult delivery time): 105 μm
According to Manufacturer capability

NTPH diameter (base material)

NTPH diameter (base material)

300 μm (FR-4 and CEM-1)
700 μm (IMS)

 

- + 0,10 / -0 mm
Or equivalent tolerance

Width and isolation of copper conductors (Base Copper)

Width and isolation of copper conductors (Base Copper)

100 μm (17 μm)
100 µm (35 µm)

200 µm (70 µm)

- ± 25%
± 25%
± 30%
-

Copper annular ring (Base Copper)

Copper annular ring (Base Copper)

100 μm (17 μm)
125 µm (35 µm)
250 µm (70 µm)

- Recommendation: for a good soldering surface, for component holes ≥ 200 µm

Distance between NPTH and copper conductor

Distance between NPTH and copper conductor

200 µm - - -

Distance between copper conductor and board edge (routed)

Distance between copper conductor and board edge (routed)

150 µm - - -

Misalignement between copper and hole

Misalignement between copper and hole

- - ± 100 µm -

Misalignement between outline and hole

Misalignement between outline and hole

- ± 150 µm

Distance between a copper conductor and theorical scoring axis

Distance between a copper conductor and theorical scoring axis

500 µm - - -

Maximum hole to be plugged with peelable mask

Maximum hole to be plugged with peelable mask

0,30 mm 1,80 mm - -

Distance between peelable mask and copper pad

Distance between peelable mask and copper pad

0,80 mm - - -

Solder mask annular ring

Solder mask annular ring

50 µm - - -

Solder mask bridge

Solder mask bridge

100 µm - - -

Distance between solder mask clearnace and copper conductor

Distance between solder mask clearnace and copper conductor

50 µm - - -

Misalignement between solder mask and copper

Misalignement between solder mask and copper

- - ± 150 µm -

Ink legend width

Ink legend width

100 µm - - -

Misalignement between ink legend and copper

Misalignement between ink legend and copper

- - ± 200 µm -

Carbon Ink width

Carbon Ink width

600 µm - - -

Separation between carbon conductors

Separation between carbon conductors

400 µm - - -

Scoring positioning (taken on axis)

Scoring positioning (taken on axis)

- - ± 150 µm -

Core thickness after scoring process

Core thickness after scoring process

200 µm - ± 150 µm Standard: 300 µm

Misalignement between top-bottom scoring blades

Misalignement between top-bottom scoring blades

- - ± 150 µm -

Final Thickness

Final Thickness

0,50 mm

1,0 mm
1,0 mm
3,2 mm

1,6 mm
3,0 mm
±  10 % (e > 1,0 mm) and  ±  100 μm (e ≤ 1,0 mm)
±  10 %
±  10 %
For FR-4 raw material


For CEM-1 raw material
For IMS raw material

Bow&Twist

Bow&Twist

- 1% of diagonal - -

Final pcb dimensions (routing)

Final pcb dimensions (routing)

15 x 15 mm 600 x 500 mm < 30 mm: ± 0.10 mm
< 120 mm: ± 0.15 mm
>120 mm: ± 0.20 mm
-
 Other - - - According to IPC-A-600 revision G Standard

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  • ZUBELZU S.L.
  • Printed Circuit Boards
  • C/Erregeoiana Nº9
  • Araso Industrial Estate
  • 20305 Irun (Spain)
  • Phone: +34 943 63 23 04
  • Fax:     +34 943 62 32 80
  • e-mail: